Components · Cooling
Laird Tflex 700 Thermal Gap Pad
MFR Laird TechnologiesMODEL Tflex 700
High-performance thermal interface material with 7.0 W/mK conductivity. Features conformable design, easy application, and excellent long-term reliability for electronics cooling.
Specifications
Specifications· 10 fields
- Thermal Conductivity
- 7.0 W/mK
- Thickness
- 0.5-5.0 mm available
- Hardness
- Shore 00 40
- Voltage Breakdown
- >10 kV/mm
- Temperature Range
- -60°C to 200°C
- Size
- 200 x 200 mm sheet
- Compression
- Conformable
- Reusable
- No
- Application
- Peel and stick
- Color
- Gray