Components · Cooling
Laird Tflex 700 Thermal Gap Pad
MFR Laird TechnologiesMODEL Tflex 700
High-performance thermal interface material with 7.0 W/mK conductivity. Features conformable design, easy application, and excellent long-term reliability for electronics cooling.
We have no supplier for this
Laird Technologies makes this, and it is listed here for reference. BOTWERX has no supplier record for it: no vendor, no vendor listing, and no price verified against one. The figure shown is indicative and is not a quote. It is not a shortage — there is no route to it through this catalogue. Ask us and we will tell you whether one can be arranged.
Specifications· 10 fields
- Size
- 200 x 200 mm sheet
- Color
- Gray
- Hardness
- Shore 00 40
- Reusable
- No
- Thickness
- 0.5-5.0 mm available
- Application
- Peel and stick
- Compression
- Conformable
- Temperature Range
- -60°C to 200°C
- Voltage Breakdown
- >10 kV/mm
- Thermal Conductivity
- 7.0 W/mK